Shenzhen Tech Park Modular Facade Envelope
Modular UHPC facade units for a LEED Platinum-certified technology campus. Integrated thermal break connections and precision-milled panel joints achieved ±1 mm installation tolerance across 12,000 m² envelope area.
Compressive Strength
110 MPa
Category
Facade
Location
Shenzhen, Guangdong Province, China
Sustainable Design Integration
The modular UHPC envelope contributed to the campus’s net-zero operational energy target through reduced thermal bridging and extended service life eliminating mid-life replacement cycles.
Quality Assurance
Every panel underwent ultrasonic pulse velocity testing and dimensional verification against BIM-derived coordinate sets prior to shipment.
Interested in a similar UHPC application? We support formulation R&D, production guidance, and OEM sourcing across China.
Get in Touch